News
PCB assembly components sourcing fails at the BOM stage, not the RFQ. Here's how to scrub part numbers, handle substitutes, and kit builds without delays.
How to spec ESD protection components without guesswork: clamping voltage, datasheet pitfalls, low-capacitance parts for high-speed lines, and sourcing ...
How to brief a communication IC distributor for CAN FD, RS-485 and Ethernet PHYs: lead times, lot traceability, isolation, ESD and second-source checks.
Diodes' new SBRFP super barrier rectifiers promise lower losses in automotive power stages. Here's what the specs actually mean for buyers and sourcing ...
Vishay's D2TO35S brings top-side cooling to a D²PAK thick film power resistor. What the thermal numbers mean for EV and industrial buyers, plus sourcing...
AI racks are pushing chip power delivery toward lower voltage, higher current and tighter margins. What buyers should check in PMICs, VRMs, MOSFETs and ...
Synopsys' AgentEngineer AI agents speed silicon-to-system design cycles. What faster chip design means for component lead times, BOM planning, and sourc...
How new fab capacity, AI demand and legacy-node shifts affect diode and transistor wholesale buyers in 2026. Practical specs, checks and sourcing angles.
Electronics Weekly calls miniature pressure sensors a core OEM component. Here's what that means for buyers: specs to check, lead time risks, and sourci...
AI-assisted formal verification is moving into RTL signoff. What the latest chip week news means for lead times, quality files, second sources and BOM r...