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QSPICE Boost Converter Episode 19: Design
QSPICE Episode 19 builds a 12V boost converter with a logic-level MOSFET. What the simulation teaches about real BOM choices, plus HUSB237 PD sink news.
Microchip 20A GaN Space Converter Meets UK
UKSA debris-removal funding and Microchip's rad-tolerant 20A GaN converter put space power sourcing, lot traceability and derating back on buyer checkli...
5G Silicon Diversity: A Sourcing Guide
New 5G silicon spans phones to vehicles. Learn how to source the right modems and modules while managing lead times, certifications, and counterfeit risk.
Co-Packaged Optics 2028 Surge: What
Meta, Broadcom and AMD are planning around a 2028 co-packaged optics surge. Here's what that means for component buyers, from power stages to lead times.
What the Latest 5G Chips and Modules Mean
EDN's roundup of new 5G chips and modules spans phones, wearables, IoT, and vehicles. Here's what the wave of new silicon means for BOM planning and sou...
Pasqal €50M Q-PLANET Project: Component Buyer Notes
Pasqal's €50M Q-PLANET pilot line will industrialize neutral-atom quantum chips. Here's what the 28-partner project means for lasers, AOMs, and photonic...
Plasma vs KOH for LCP Metallization: Buyer Signals
SCHIEDERWERK's electronica 2026 power news is a useful prompt to recheck LCP metallization, plasma prep, PSU specs, lead times and sourcing risk.
OMNIVISION OG05D global shutter HDR sensor
OMNIVISION's OG05D puts 5MP global shutter HDR on a 2.2µm pixel. What engineers should check on optics, interfaces, lead time and traceability.
Rohm’s Back-End Shift Makes Continuity
Rohm’s India back-end expansion puts ATE continuity, contactor health and lot traceability on the buyer checklist before parametric tests even start.
Teradyne Magnum E2 memory test system
Teradyne's Magnum E2 targets advanced DRAM and high-speed NAND flash testing. What the new memory test platform signals about device quality and sourcin...